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PCB separator (YLVC-2) 2010-7-30
PCB separator (YLVC-2) 1.Separates boards up to 2.5mm thick 2.Shears boards safely with parts as close as 0.5mm to the score line, including ceramic capacitors 3.Operator foolproof! Panels cannot be inserted into the knives except on the score line 4.Pn
Search Keywords: PCBseparator
YALAN Electronic Equipment Manufactory

PCB separater(YLV-2A) 2010-7-30
PCB depaneling (YLV-2A) 1.Separate PCB assembly without stress on either PCB or component 2.One touch programming of cut length with digital display 3.Separating speed is adjusted by a rotary knob 4.Handle Intermittent scoring or cut-outs 5.Board w
Search Keywords: Electronic Equipmen
YALAN Electronic Equipment Manufactory

PCB separater（YLV-1M) 2010-7-30
PCB separater（YLV-1M) 1.Separate pre-scored PCB assembly without stress on either PCB or component 2.Separating speed controlled by manual. 3.Board with projected component can be cut precisely 4.Large stainless steel platform on both side of cutting bl
Search Keywords: Electrical Equipmen
YALAN Electronic Equipment Manufactory

FPC /PCB punching (YLPE) 2010-7-30
FPC /PCB punching (YLPE) 1. Cast iron frame work for rigidity. 2. Easy and safty operation. 3..Depaneling PCB/FPC by means of punching dies, to avoid micro-cracks caused by manual. 4.Punching dies are changeable. Easy set up of punching dies. 5.Moveab
Search Keywords: Electrical Equipmet
YALAN Electronic Equipment Manufactory

PCB depanel (YLVC-1S) 2010-7-30
PCB depanel (YLVC-1S) 1.Guide can be adjusted vertically to suit different PCB thickness. 2.Clearance between the circular blades can be precisely adjusted with the knob. 3.Upper and lower circular blades can be re-used after regrinding. 4.Shape and siz
Search Keywords: Electrical Equipment
YALAN Electronic Equipment Manufactory

PCB Assembly 2010-7-28
pb free, SMT, DIP
Search Keywords: Passive Components PCBA
Shenzhen Beyond PCB & PCBA Ltd

multilayer pcb 2010-7-28
Base material: FR4, FR1, FR2, CEM-1, CEM-3 Layer:1-12 layer Board thickness: 0.30 to 3.20mm (12 to 26mil) Copper thickness: 0.50 to 5 ounce Solder mask: LPI solder mask, conventional solder mask, peelable solder mask, UV solder mask Minimum line width
Search Keywords: Passive Components PCB multilayer pcb
Shenzhen Beyond PCB & PCBA Ltd

Gold finger PCB 2010-7-28
1). FR-4 Material 2). 2 layer, 1.2mm thick 3). 1 oz copper weight. 4). LPI Green solder mask/White silk screen 5). Gold finger 40 microinch, bevelled. 6). HASL + Gold finger, ENIG + gold finger 7). Large volume, punch contour.
Search Keywords: Passive Components
Bicheng Enterprise Company

Fine pitch BGA PCB 2010-7-28
1). 177 x 75mm (2UP), FR-4 Tg 170 2). 1.6mm +/-10%, 6 layer 3). Min. hole 0.15mm, 4/4 track/gap 4). Finished copper weight inner/outer 1 oz 5). Green solder mask/ White ident 6). Immerstion gold. 7). Fine and micro BGA
Search Keywords: Passive Components
Bicheng Enterprise Company

Mini PCB 2010-7-28
1). 6mm x 6mm, FR-4, 2). 1mm +/-0.1mm，Double sided 3). 2oz copper finished 3). Black solder mask/no silk ident 4). Immersion gold surface finish 5). LED products application
Search Keywords: Passive Components
Bicheng Enterprise Company

Mixed material PCB (ROGERS+FR4) 2010-7-28
1). FR-4 Tg 170 + Rogers 4350B 2). 290*130mm/1up 3). 6 layers at 1.6mm thick 4). Green solder mask/White ident 5). 35um copper finished, ED copper. 6). Electroless gold. 7). Countersunk slots.
Search Keywords: mixed material
Bicheng Enterprise Company

Taconic TLX-8 PCB 2010-7-28
1). 221*80mm, TLX08-300 CI/CI, 2). ER 2.55, 1 OZ, 0.8mm substrate 3). Double sided. 4). No solder mask/ NO ident 5). OSP
Search Keywords: Taconic
Bicheng Enterprise Company

Prototype of rigid-flex PCB 2010-7-28
1). 100*85mm, FR-4 Tg170/ Polyimide 2). 4 layer count rigid/2 layer flex 3). 1.0mm thick rigid/0.15mm thick flex 4). 1 oz each layer 5). Green LPI solder mask/white ident 6). Immersion gold
Search Keywords: Passive Components
Bicheng Enterprise Company

Stainless steel backed PCB 2010-7-28
1). Stainless steel 316L grade 2). Single sided, 0.8mm thick 3). 1 oz copper weight 4). Surface finish: OSP 5). Contour: Laser cut. 6). Used in LED etc power PCB in a very bad environment.
Search Keywords: Passive Components
Bicheng Enterprise Company

Double sided PCB 2010-7-28
1) FR-4 Tg135, 2 layers, 1.6mm thick 2) 1 oz finished copper weight 3) Dielectric constant(Er): 4.4-5.2 4) Min. track/space: 4/4 mils 5) LPI Solder mask/White ident 6) Min. hole size: 0.3mm 7) Finish: immersion gold
Search Keywords: Passive Components
Bicheng Enterprise Company

Aluminium PCB 2010-7-28
1) Chinese-source aluminium backed PCB, 2) Thermal conductivity: 1.0 to 2.5 W/m-k 3) Single sided, 1.6mm, 1 oz. 4) Min. track/space: 0.14mm/0.14mm 5) LPI white solder mask/ black ident 6) Finish: ENIG 7) Profile: Punching/CNC rout
Search Keywords: Passive Components
Bicheng Enterprise Company

Teflon PCB 2010-7-28
1) Chinese-source, Woven Glass-Reinforced PTFE 2) Single side/Doulbe sided, 3) Dielectric constant Er:= 2.55, 2.65, 2.75, 2.90, 3.0, 3.5 4) Copper weight: 0.5 - 3 oz 5) PCB thickness: 0.17-3.0mm 6) Track/space: per drawing 7) Finish: Copper finish.
Search Keywords: Passive Components
Bicheng Enterprise Company

CEM-1 and CEM-3 PCB 2010-7-28
1). Material: CEM-1/CEM-3, 2). Single sided, 1.6mm material 3). 1 oz copper finished 4). Green solder mask/white silkscreen letter 5). OSP surface finish 6). Contour profile: punch
Search Keywords: Passive Components
Bicheng Enterprise Company

Impedance control PCB 2010-7-28
1). FR-4, Tg 170, 1 oz copper finished 2). 4 layers, 2.5mm thick 3). Min.track/space: 4/4 mil 4). Min. hole size: 0.25mm 5). 50 ohm, 100+/-10% ohm differentail /single impedance control 6). Immersion gold
Search Keywords: Passive Components
Bicheng Enterprise Company

silver through hole PCB 2010-7-28
1). Material CEM-3, FR-1 2). Double sided, 1.6mm, 1oz 3). Silver through hole 4). Green solder mask/white silk screen 5). OSP finish 6). Contour profie: Punch
Search Keywords: Passive Components
Bicheng Enterprise Company

Total: 693 Current Page: 1/35 Next Last

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