Detailed Product Description
Material: FR-4, FR-1, CM-1, high frequency Surface finish: HAL, gold plating, gold finger, immersion silver, immersion gold, immersion tin, OSP Profile: routing, punching, V-cut, chamfering Mini hole: 0.2mm Mini line width: 4mil (0.1mm) Mini line space: 4mil (0.1mm) Copper thickness: from 0.5oz. to 6oz. Special process: blind/buried hole Inner packing: Vacuum package Outer packing: Carton
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